PORON® ShockPad Foam

The newest smartphones, tablets and other mobile internet devices (MID) are as slim as ever, and designers are being asked to fit even more features and gadgets into these tiny packages. As part of space-saving designs, the display, the printed wiring board, and other electrical components are compacted into very thin spaces. Unfortunately, these components often lack proper impact protection technology.

PORON® ShockPad Foam has always been a reliable impact solution when used behind gasketless MID displays, in front of printed wiring boards (PWB) and alongside other internal components. Now, with an even thinner profile, ShockPad is more versatile than ever.

Key Benefits & Features
  • Provides up to 7 times greater impact protection
  • Excellent compression-set resistance
  • Ease of processing to eliminate production delays

Smartphone Impact Testing

This images below were compiled using the following test conditions:
  • Impacting Object: 30.8 g brass ball
  • Height of Drop: 0.3 meters
  • Display Module: 0.5 mm glass on both sides of foam
  • Material Demonstration: 0.3mm Foam
PORON Shockpad Foam
PORON Shockpad Foam
Competitive Material
Competitive Material